The following is a news release from Master Bond Inc. You have received it because you are listed as an editor for your publication. Attached to this email is a low resolution version of the photograph that is included in the press kit for this product. High resolution version of this image and files with the body text of this release in Word, HTML and text formats are available at http://www.masterbond.com/newsrelease/ep3uf. ----------------------------------------------------------------- FOR IMMEDIATE RELEASE No Mix, Thermally Conductive, Electrically Insulative Epoxy for Underfill Applications Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)] and a volume resistivity exceeding 1014 ohm-cm. EP3UF also passes NASA low outgassing tests and can be used for bonding and underfills in microelectronics packaging/assembly applications. As a single component system, EP3UF is easy to handle with an “unlimited” working life at room temperature and fast cures at temperatures as low as 250°F. This high performance system delivers a tensile strength of 5,000-7,000 psi and a compressive strength of 18,000-20,000 psi. It bonds well to a variety of substrates such as metals, composites, ceramics, and many plastics. This dimensionally stable compound has low shrinkage upon curing. EP3UF withstands many chemicals, including water, cleaning solvents, oils and fuels. This light yellow colored epoxy is serviceable over the temperature range of -60°F to +250°F [-51°C to +121°C]. It is available for use in 10 cc syringes, 30 cc syringes, ½ pint and pint containers and has a 6 month shelf life at room temperature in its original, unopened containers. Master Bond Underfill Adhesives Well suited for underfill applications, Master Bond EP3UF is a single component compound that cures rapidly at elevated temperatures. It offers thermally conductivity, electrical insulation and dimensional stability. Read more about Master Bond’s underfill encapsulants at http://www.masterbond.com/industries/underfill-encapsulants or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com. Note to Editors: For a full product description, please visit: http://www.masterbond.com/tds/ep3uf Check out new videos on our YouTube channel: http://www.youtube.com/user/MasterBondVideo You can embed any of our videos on your website. CONTACT James Brenner, Marketing Manager Email: jbrenner@masterbond.com Tel: +1-201-343-8983 Fax: +1-201-343-2132 MASTER BOND INC. 154 Hobart Street Hackensack, NJ 07601-3922 Web: www.masterbond.com # # #