Toughened, Two Component Epoxy Adhesive/Sealant Featuring High Temperature and Chemical Resistance; Superior Thermal Cycling Capabilities.
One component, heat curing epoxy for structural bonding applications
One part, thermally conductive, electrically insulating, high performance epoxy for bonding and sealing; meets NASA low outgassing specifications
Two component epoxy compound for bonding, coating, sealing and encapsulation
One component, electrically conductive sodium silicate, aqueous based coating system
One component, thermally conductive epoxy adhesive
