Master Bond offers a wide range of versatile, high performance epoxy formulations to withstand the severe conditions found in cryogenic environments. These adhesives, sealants and coatings are available as one or two part systems, requiring either ambient or elevated temperature cures.
Top Adhesives for Cryogenic Applications and How They Have Been Used
See below how Master Bond’s cryogenic adhesives have been utilized in various commercial and research applications worldwide.
Special Grades of Cryogenic Epoxies Are:
- Electrically conductive
- Thermally conductive/electrically insulative
- Cryogenic shock resistant
- Optically clear
- NASA low outgassing approved
- Mechanical shock resistant
These products are utilized by engineers in a wide range of different branches of technology for:
- Satellites
- Energy storage
- Sensors
- Telecommunications
- Cryosurgery
- Magnetic resonance imaging
- Superconductivity
- High energy physics
Learn more about our cryogenic epoxies for the Liquefied Natural Gas Industry.
Some of Our Most Popular Cryogenic Adhesive Systems
 |
EP29LPSP Two part epoxy system with ultra low viscosity and remarkable cryogenic properties. Withstands rapid drop in temperature and is NASA low outgassing approved. Optically clear. Long working life. Low exotherm. Excellent resistance to acids, bases and many solvents. Outstanding electrical insulative properties. Service operating temperature range from 4K to +275°F. |
 |
EP21TCHT-1 Two part, room temperature curable epoxy system with high thermal conductivity. Serviceable from cryogenic temperatures up to +400°F. Electrically isolating. Meets NASA low outgassing specifications. Halogen free. Paste consistency. Formulated to cure at ambient temperatures. Withstands 1,000 hours 85°C/85% RH. |
 |
EP29LPSPAO-1 BLACK Thermally conductive/electrically insulative epoxy for bonding, sealing, potting. Good flow properties. Serviceable from 4K to +250°F. Can withstand cryogenic shocks. High dimensional stability. Complies with NASA low outgassing specifications. Black color. |
 |
EP21TDCS-LO Silver conductive, room temperature curing epoxy adhesive meets NASA low outgassing specifications. Serviceable from 4K to +275°F. High bond strength properties. Withstands thermal cycling. Outstanding toughness. Volume resistivit <10-3 ohm-cm. Paste viscosity. Convenient one to one mix ratio by weight or volume. |
 |
EP51CC Easy to apply, paste like consistency two component epoxy adhesive. High bond strength. Can be packaged for use in field applications. Serviceable at cryogenic temperatures down to 4K. |
 |
EP21TDC-2LOND Highly flexible epoxy paste adhesive. Outstanding peel strength. Elongatio >25%. Thermally conductive/electrically insulative. Low outgassing. |
 |
EP37-3FLFAOND Highly flexible, low viscosity adhesive. Resistant to severe thermal cycling and thermal shock. Bonds well to dissimilar substrates. Low exotherm system. Long working life. Superior electrical insulation properties. Service temperature range from 4K to +250°F. One to one mix ratio by weight or volume. |
 |
Supreme 33ND Toughened, two component, non-drip epoxy adhesive, sealant, coating. Gap filling. Temperature range from -80°F to +425°F. Thermal shock and chemical resistant. Excellent durability and dimensional stability. Minimal shrinkage upon curing. Solid electrical insulator. Withstands 1,000 hours 85°C/85% RH. |
