Low Temperature Serviceability

Adhesive serviceability at cold temperatures presents a number of challenges. Often, adhesives will crack at lower temperatures. Others will debond/delaminate from a substrate material. Epoxy adhesives in particular do very well at low temperatures. They actually increase in bond strength and their physical properties are higher than at room temperatures. In fact many epoxies can be used in cryogenic applications for bonding, sealing, potting/encapsulation. Select silicone systems perform well at -40°C to -50°C. Other special formulations are designed to withstand -100°C. It is important to note that these silicone systems remain highly flexible at low temperatures. Epoxy polysulfides and urethane-modified epoxies are also noted for their serviceability at low temperatures.

Performance properties of adhesives designed for low temperature environments

Master Bond has been at the forefront in the development of adhesives for low temperature environments. These one and two component compounds are blended with unique ingredients/fillers that are engineered to optimize mechanical/chemical/electrical performance. These products are available in flowable/ non sag viscosities and can be dispensed with automatic, semi-automatic and manual applicators. Our line of adhesives includes electrically conductive systems, thermally conductive/electrically insulative systems, optically clear formulas and NASA low outgassing products. They are presently employed in the assembly of:

• honeycomb sandwich structures
• vessels and tanks
• automotive parts
• electrical enclosures
• transformers
• deep submergence vehicles
• refrigeration equipment

To ensure bonded joint durability/longevity careful consideration should be given to length of low temperature exposure, temperature variations and rate of temperature change. Adhesive selection is also dependent on the types of substrates being joined, configuration of the parts and bond line thickness.