Epoxy

EP29LPSPAO Product Information

EP29LPSPAO Two Part Epoxy

Two Component, Thermally Conductive, Electrically Insulative, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing, Coating, Potting and Encapsulation. Cryogenically Serviceable and Capable of Withstanding Cryogenic Shock.

EP29LPSPAO-1 Black Product Information

EP29LPSPAO-1 Black Two Part Epoxy

Two Component, Thermally Conductive, Electrically Insulating, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing, Coating, Potting and Encapsulation. Cryogenically Serviceable and Capable of Withstanding Cryogenic Shock. Meets NASA Low Outgassing Specifications.

EP3 Product Description

EP3 One Part Epoxy

One Component Heat Curing Epoxy Adhesive Featuring Both High Shear and High Cure Speed for Optimal Bonding Performance

EP30 Product Information

EP30 Two Component Epoxy Adhesive System

Highly Versatile, Low Viscosity, Two Component Epoxy System for High Performance Bonding, Coating, Sealing and Casting; Featuring Superb Optical Clarity.

EP30-2 Product Information

EP30-2 Two Part Epoxy Compound

Versatile Lower Viscosity, Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation; Features Superior Optical Clarity; Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.

EP30-2SP Product Description

Low Viscosity, Two Component Epoxy Resin System For High Performance Bonding, Laminating and Sealings

EP30-3 Product Information

EP30-3 Two Part Epoxy Compound

Two Component, Low Viscosity, Optically Clear Epoxy Featuring Outstanding Temperature and Chemical Resistance for Service up to 450°F. Requires Heat Curing at 250-300°F.

EP30-4 Product Information

EP30-4 Two Part Epoxy System

Optically Clear, Two Component Epoxy Adhesive for High Performance Bonding, Coating, Sealing and Casting Featuring Superior Non-Yellowing Properties, Low Viscosity and Rapid Curing.

EP30AN Product Information

EP30AN Two Part Epoxy

Two Component, Room Temperature Curing Epoxy for Potting, Bonding, Sealing and Coating with Unsurpassed Thermal Conductivity and Superb Electrical Insulation; Features Low Viscosity and Excellent Thermal Transfer Properties.

EP30AN-1 Product Information

EP30AN-1 Two Part Epoxy

Two Component, Room Temperature Curing, Low Viscosity Epoxy for Potting, Sealing, Coating and Bonding Featuring Exceptionally High Thermally Conductivity and Excellent Electrical Insulation Properties. Now NASA Approved for Low Outgassing Applications

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