Toughened, Two Component, Room Temperature Curing Epoxy System for Bonding, Coating, Sealing and Encapsulation Featuring Abrasion Resistance and Cryogenic Serviceability.
Two Component, Room Temperature Curing Epoxy Polysulfide for High Performance Bonding, Sealing, Coating and Encapsulation, Offers Excellent Toughness along with Superior Resistance to Chemicals, Particularly to Fuels and Oils.
Two Component, Room Temperature Curing Epoxy Polysulfide for High Performance Bonding, Sealing, Coating and Encapsulation, Offers Excellent Toughness along with Superior Resistance to Chemicals, Particularly to Fuels and Oils.
Two Component, Room Temperature Curing Epoxy Polysulfide for High Performance Bonding, Sealing and Coating Offers Exceptional Toughness along with Superior Resistance to Chemicals, Particularly to Fuels and Oils; Paste-Like Consistency.
One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.
One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.
One Component, Nanosilica Filled UV Curable Epoxy System that cures in shadowed out areas for Bonding, Sealing, Coating and Encapsulation. Thixotropic paste.
One Component, Nanosilica Filled UV Curable Epoxy System that cures in shadowed out areas for Bonding, Sealing, Coating and Encapsulation. Thixotropic, moderate viscositiy.
