Two Component Heat Resistant Epoxy Adhesive, Sealant, Encapsulant With High Thermal Conductivity, and Excellent Dimensional Stability Up to 400°F Service
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Acids Along with Higher Temperature Resistance.
Low Viscosity, Two Component Epoxy For High Performance, Bonding, Sealing, Coating and Potting Applications. Featuring Excellent Flexibility and Thermal Cycling Capabilities. Red Color.
Low Viscosity, Toughened, Two Component Epoxy System for High Performance Bonding, Sealing and Encapsulation, Capable of Withstanding Rigorous Thermal Cycling; Very Low Exotherm and Exceptionally Long Working Life.
