Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive for Bonding, Sealing, Coating and Encapsulating Featuring a Convenient and Forgiving 1:1 Mix Ratio.
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive, Sealant and Coating Featuring a 1:1 Mix Ratio and High Temperature Resistance Up To 400°F
Two Component Heat Resistant Epoxy Adhesive, Sealant, Encapsulant With High Thermal Conductivity, and Excellent Dimensional Stability Up to 400°F Service
Two Part, Room Temperature Curing Epoxy System Offers Thermal Conductivity and Electrical Insulation for Potting & Encapsulation as well as Bonding, Sealing and Coating; Has a Forgiving One to One Mix Ratio.
Two Component, Radiopaque Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation featuring Outstanding Performance Properties and Easy Handling
Low Viscosity, Two Component Epoxy For High Performance, Bonding, Sealing, Coating and Potting Applications. Featuring Excellent Flexibility and Thermal Cycling Capabilities. Red Color.
Low Viscosity, Toughened, Two Component Epoxy System for High Performance Bonding, Sealing and Encapsulation, Capable of Withstanding Rigorous Thermal Cycling; Very Low Exotherm and Exceptionally Long Working Life.
Two Component, Flame Resistant, Epoxy System for Potting, Encapsulating and Casting. Features a Non-Halogen Filler and Produces Very Low Smoke Levels. Meets UL 94V.0 Flame Retardant Specification.
