Two Component, Low Viscosity Epoxy Adhesive/Sealant For High Performance Bonding Featuring Excellent Electrical Insulation Characteristics, High Thermal Stability and Superior Chemical Resistance.
Two Component, Low Viscosity, Room Temperature Curing Epoxy Resin System For High Performance Potting, Encapsulation, Sealing and Bonding Featuring Outstanding Resistance to Thermal Shock and Mechanical Vibration, Serviceable up to 450°F
One Component, Thermal Shock and Heat Resistant, Flexibilized Epoxy System for Bonding, as well as for Potting and Encapsulations up to ¼ Inch Thick; Features Good Toughness and Fast Cures.
One Component Thermal Shock and Heat Resistant Flexibilized Epoxy System For High Performance Electrical Potting, Encapsulation and Bonding Superior for underfill applications
One Component, Heat Curing, Silver Filled, Electrically Conductive Epoxy Adhesive/Sealant Featuring High Shear Strength and Good Temperature Resistance Along With a Rapid Cure Speed.
One Component, Heat Curing, Silver Filled, Electrically Conductive Epoxy Adhesive/Sealant Featuring High Shear Strength and Good Temperature Resistance Along With a Rapid Cure Speed
