From conformal coatings to surface mount adhesives or from conductive films to thermal management products, Master Bond is leading the way in electronic assembly applications. Our line of epoxies, silicones, polyurethanes, polysulfides, cyanoacrylates and UV cures feature innovative solutions to challenging industry requirements.
Benefits of Master Bond Electronic Grade Compounds
Master Bond is actively engaged in developing new products for advanced electronic systems. Our compounds offer the following advantages:
- Widest range of formulations
- Consistent reproducible high performance systems
- Latest technology
- Easy application—simple packaging (including premixed and frozen syringes)
- Available direct from manufacturer
- Custom formulations available
One and Two Component Systems to Meet the Needs of the Electronic Assembly Industry
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EP30AO Low viscosity, thermally conductive potting, bonding and sealing compound. Cures at room temperature. Superior electrical insulation properties. High compressive strength. Rigid bonds. Low thermal expansion coefficient. Excellent dimensional stability. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +250°F. |
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EP30LTE-LO Two component epoxy system. Extra low thermal expansion coefficient and unmatched dimensional stability. Bonding, sealing, casting compound. Passes NASA low outgassing specifications. Room temperature curing. Low shrinkage. Serviceable from 4k to +250°F. Successfully tested for 1,000 hours 85°C/85% RH. |
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Supreme 10ANHT Thermally conductive version of our one part Supreme 10HT epoxy system with excellent heat transfer properties. Outstanding bond strength. Thermal conductivity 20-25 BTU ·in/ft2 ·hr/°F. Serviceable from 4k to +400°F. Superior durability. Versatile cure schedule at elevated temperatures. Can withstand prolonged exposure to water, fuels, oil, organic solvents. Gray color. |
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EP21AOLV-2LO Two part, ambient temperature curing epoxy potting/encapsulation compound. Thermally conductive/electrically isolating. Very low exotherm. Suitable for large castings. Meets NASA low outgassing specifications. Service operating temperature range from -60°F to +250°F. Withstands 1,000 hours 85°C/85% RH. |
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EP17HT-3 One part snap cure epoxy. Cures in 2-3 minutes at 250-300°F. Service operating temperature range -60°F to +400°F. Ideal for bonding dissimilar substrates and applications subject to thermal cycling. Outstanding electrical insulation properties. Withstands 1000 hours at 85°C/85%RH. |
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EP30FLAO Flexibilized, thermally conductive, electrically insulative potting compound. Excellent flowability. Low thermal expansion coefficient. Superior dimensional stability. Serviceable from 4k to +250°F. Resists water, oils, many solvents. Good physical strength properties. |
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Supreme 3HTND-2GT Superior one part glob top. Outstanding dimensional stability and temperature resistance. Fast cures at 125-150°C. Ideal flow for glob topping. Serviceable from -100°F to +400°F. Excellent electrical insulation properties. Low shrinkage. Resists thermal cycling. |
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EP51AN Rapid room temperature curing thermally conductive/electrically insulative adhesive. Fast gelling. Low CTE. Serviceable from 4K to +250°F. High bond strength. Superior heat dissipative properties. Dimensionally stable. Chemical resistant. |
