Two component, silver filled epoxy adhesive, sealant
Key Features
- One to one mix ratio
- Paste consistency
- Cures at ambient temperature
- Excellent electrical conductivity
Product Description
Master Bond polymer system EP77MHT-1 is a two component silver filled conductive epoxy adhesive for high performance bonding and sealing. It is formulated to cure at room temperature or faster at elevated temperatures. It has a non-critical mix ratio of one to one by weight or volume. EP77MHT-1 exhibits minimal shrinkage upon cure. The system is 100% reactive and does not contain any solvents or diluents.
EP77MHT-1 has high strength, tough bonds that are resistant to thermal cycling. It also has a high degree of dimensional stability. The epoxy bonds well to both similar and dissimilar substrates, including metals, glass, ceramics, fiber reinforced plastics and vulcanized rubbers. It withstands an array of chemicals, including water, oils, and fuels. The temperature range is -60°F to +300°F. The color of Parts A and B is silver. EP77MHT-1 is suitable for applications where a heat sensitive part cannot be exposed to high temperatures as well as for manufacturing operations where short elevated temperature oven cures are desired. It is used in the electronics industry with applications including bonding components to PC boards, antenna bonding, lead attachments, EMI/RFI shielding, as well as medical devices and other industries.
Product Advantages
- Convenient mixing, 1:1 mix ratio
- High electrical conductivity
- Bonds well to a variety of substrates
- Withstands thermal cycling
- Superior shear and peel strengths
- Outstanding dimensional stability
Industrial Certifications
Packaging
EP77MHT-1 is available is various sizes and units to accommodate customer's needs.
