Researchers in Germany wrote a paper on how a miniaturized sensor for dissolved oxygen was fabricated in silicon thin film technology. In this paper, they cited Master Bond as follows. “Finally, the chip and the bond wires were encapsulated with a two component epoxy resin EP21.”1
Two component, room temperature curing epoxy compound
Key Features
- Moderate viscosity
- Electrically insulative
- Room temperature curing
- One to one mix ratio — rigid to flexible cure
- Shore D hardness 70-80
- Dimensionally stable