Silver filled, electrically conductive, two component epoxy pastes and one part silicone pastes shield electronic circuits, modules and subsystems from EMI and grounding. Epoxy systems feature gap filling properties, thermal cycling resistance, high bond strength and room temperature cures. Silicone compounds require no mixing and are recommended for adhering surfaces with differing coefficients of thermal expansion and contraction.
Uses for EMI Shielding and Grounding Products
- Computers
- Medical instruments
- Telecommunication devices
- Microwaves
- Automotive components
EMI Shielding and Grounding Products Applications
- Attaching EMI vents
- Bonding conductive gaskets
- Filling cracks and seams
- Attaching conductive grounding pads
- Ground chassis and electronic boxes
- Bonding shielded windows into metal holders
Features of EMI Shielding and Grounding Compounds
- Superior electrical conductivity
- Room temperature curing
- High/low temperature resistance
- Aging resistance
- Easy application
