Two Component, Room Temperature Curing, Low Viscosity Epoxy for Potting, Sealing, Coating and Bonding Featuring Exceptionally High Thermal Conductivity, Excellent Electrical Insulation Properties and Exceptionally Long Working Life.
Two Component, Room Temperature Curing, Low Viscosity Epoxy for Potting, Sealing, Coating and Bonding Featuring Exceptionally High Thermal Conductivity, Excellent Electrical Insulation Properties and Exceptionally Long Working Life.
Master Bond EP30AN-1LP is a two part epoxy for high performance bonding, coating, sealing and potting applications with a 100:10 mix ratio by weight. It features exceptionally high thermal conductivity, excellent electrical insulation properties and an extended open time. It will cure at room temperature or more rapidly at elevated temperatures. The optimum cure schedule being overnight at room temperature followed by 3-4 hours at 150-200°F. It has good adhesion to a wide variety of substrates including metals, glass, ceramics, composites and many rubbers and plastics. Other attractive properties include superb dimensional stability and superior physical strength properties. EP30AN-1LP does very well in resisting rigorous thermal cycling and is also an excellent adhesive forming durable, rigid bonds. It resists a variety of chemicals including water, oils, fuels, and many acids and bases over the wide temperature range of -60°F to 250°F. Also noteworthy is its low coefficient of thermal expansion. Additionally it has low outgassing properties enabling it to be used in high vacuum environments. The color of Part A is gray and Part B is clear. Master Bond EP30AN-1LP is particularly well suited for applications where thermal conductivity, electrical insulation and a long working life are desirable.
Product Advantages
- Easy application: low viscosity with excellent flowability; ideal for potting and casting.
- Versatile cure schedules: ambient temperature cures or fast elevated temperature cures as required.
- High bond strength to a wide variety of substrates; excellent adhesive properties.
- Exceptionally high thermal conductivity with excellent electrical insulation properties.
- Low thermal expansion coefficient; superior dimensional stability.
- Good physical strength characteristics; especially high compressive strength.
- Exceptionally long working life.
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- Epoxy |
- Chemically Resistant |
- Dimensionally Stable |
- Electrically Insulative |
- Thermally Conductive |
- Low Viscosity |
- Heat Cure |
- Room Temperature Cure |