Expanded Product List
Master Bond Product Search
110 products match
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EP3SP5FL Single component snap cure adhesive. Unsurpassed curing speed of 1-2 minutes at 300°F. Moderate viscosity with good flow properties. Easy to dispense. Good tensile lap shear strength. Repairable. Serviceable from -60°F to +200°F. |
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EP3SP5FL-ND2 Snap cure epoxy adhesive. Paste viscosity. Cures in 1-2 minutes at 300°F. Readily reworkable. Good bond strength and electrical insulation properties. Serviceable from -60°F to +200°F. |
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EP3UF One component epoxy for bonding and underfill applications. Thermally conductive/electrically insulative. Meets NASA low outgassing specifications. High mechanical strength properties. Ultra fine particle sizes lowers thermal resistance. Convenient processing at moderate temperatures. Serviceable from -60°F to +250°F. |
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EP3UF-1 One component epoxy for bonding and underfill applications. Thermally conductive/electrically insulative. Meets NASA low outgassing specifications. High mechanical strength properties. Ultra fine particle sizes lowers thermal resistance. Convenient processing at moderate temperatures. Serviceable from -60°F to +250°F. |
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EP4CL-80 One component, ultra low viscosity epoxy that offers thermal and electrical insulation and is optically clear. |
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EP4CL-80Med One component, ultra low viscosity epoxy that offers thermal and electrical insulation and is optically clear. |
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EP4EN-80 One component, low viscosity epoxy that offers thermal conductivity, electrical insulation and a filler material with ultra small particle sizes. This imparts high mechanical strength properties, outstanding dimensional stability and low shrinkage upon curing. |
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EP4G-80 Graphite filled epoxy that cures at 80°C. Good electrical and thermal conductivity. Passes NASA low outgassing certification. Can be used for bonding, sealing, coating. Service temperature range is -50°C to +175°C |
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EP4G-80Med Graphite filled epoxy that cures at 80°C. Good electrical and thermal conductivity. Passes ISO 10993-5 certification. Can be used for bonding, sealing, coating. Service temperature range is -50°C to +175°C |
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EP4NS-80 One component, optically clear, exceptionally low viscosity epoxy for bonding and sealing. Typically, curing is at 80°C for 2-4 hours, and for full optimization of properties, this should be followed by 110-125°C for 1-2 hours. Unlimited working life at room temperature. Excellent dimensional stability, low CTE and minimal shrinkage upon curing. |