Expanded Product List
Master Bond Product Search
435 products match
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EP46HT Heat resistant epoxy adhesive/sealant. Exhibits exceptional mechanical strength. Low viscosity system. Long pot life. Cures at elevated temperatures. Long term high temperature structural strength retention. Serviceable from -80°F to +500°F. Outstanding chemical resistance. Used in filament windings and with composite structures made from glass, polymide and graphic fiber. |
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EP46HT-1 Oven curing two part epoxy system. Resists from -100°F to +600°F. Tg of 230-240°C . Superb choice as matrix resin for fiber reinforced heat resistant composite structures. Exceptional strength properties. Robust chemical resistance. Long working life after mixing. |
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EP46HT-1ND-2 Heat resistant epoxy paste adhesive. Serviceable from -100°F to +600°F. Requires oven curing. Will not flow during processing. Superior electrical insulation and chemical resistant properties. Excellent mechanical strength. |
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EP46HT-2 Serviceable from -100°F to +500°F. Tg 155-165°C. Superior durability. Heat curing, two component epoxy compound. Resists thermal cycling. Withstands 1,000 hours 85°C/85% RH. Good electrical insulator. Ability to protect against hostile chemical exposure. |
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EP46HT-2Med USP Class IV approved, heat resistant epoxy adhesive. Glass transition temperature in excess of 220°C. Withstands repeated exposure to autoclaving, radiation and chemical sterilants. High bond strength. Superior durability. Serviceable from -100°F to +500°F. Electrically insulative SUitable for potting. |
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EP46HT-2ND2 Two part non-drip epoxy paste. Resists long term exposure from -100°F to +550°F. Superior peel strength. Protects against exposure to oils, fuels, hydrocarbons, acids, bases, solvents. Withstands thermal cycling and shock. |
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EP4CL-80 One component, ultra low viscosity epoxy that offers thermal and electrical insulation and is optically clear. |
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EP4CL-80Med One component, ultra low viscosity epoxy that offers thermal and electrical insulation and is optically clear. |
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EP4NS-80 One component, optically clear, exceptionally low viscosity epoxy for bonding and sealing. Typically, curing is at 80°C for 2-4 hours, and for full optimization of properties, this should be followed by 110-125°C for 1-2 hours. Unlimited working life at room temperature. Excellent dimensional stability, low CTE and minimal shrinkage upon curing. |
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EP50-1.5 Rapid room temperature curing two component epoxy adhesive. Fixturing time of 5-8 minutes. Working life after mixing a 40 gram batch 2-3 minutes. One to one mix ratio by weight or volume. Solid tensile shear strength. Serviceable from 4K to +250°F. Available in different colors and viscosities. |