Meets EU Directive 2015/863

EP29LPSPAO-1 Black Product Information

EP29LPSPAO-1 Black Two Part Epoxy

Two Component, Thermally Conductive, Electrically Insulating, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing, Coating, Potting and Encapsulation. Cryogenically Serviceable and Capable of Withstanding Cryogenic Shock. Meets NASA Low Outgassing Specifications.

EP30 Product Information

EP30 Two Component Epoxy Adhesive System

Highly Versatile, Low Viscosity, Two Component Epoxy System for High Performance Bonding, Coating, Sealing and Casting; Featuring Superb Optical Clarity.

EP30-2 Product Information

EP30-2 Two Part Epoxy Compound

Versatile Lower Viscosity, Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation; Features Superior Optical Clarity; Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.

EP30AN Product Information

EP30AN Two Part Epoxy

Two Component, Room Temperature Curing Epoxy for Potting, Bonding, Sealing and Coating with Unsurpassed Thermal Conductivity and Superb Electrical Insulation; Features Low Viscosity and Excellent Thermal Transfer Properties.

EP30AN-1 Product Information

EP30AN-1 Two Part Epoxy

Two Component, Room Temperature Curing, Low Viscosity Epoxy for Potting, Sealing, Coating and Bonding Featuring Exceptionally High Thermally Conductivity and Excellent Electrical Insulation Properties. Now NASA Approved for Low Outgassing Applications

EP30ANHT Product Description

EP30ANHT Two Part Epoxy

Two Component, Room Temperature Curing Epoxy for Bonding, Sealing, Coating & Encapsulation with Exceptional Thermal Conductivity, Electrical Isolation and High Temperature Resistance.

EP30AO Product Information

EP30AO Two Part Epoxy Resin System

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy for Potting, Bonding, Sealing & Coating. Features Low Viscosity & Excellent Thermal Transfer Properties.

EP30C Product Information

EP30C Two Part Epoxy

Two Component, Nickel Modified Room Temperature Curing Polymer System Featuring High Electrical Conductivity, Superior Bonding Strength and Chemical Resistance For EMI/RFI Shielding As Well As Bonding, Sealing and Encapsulation Applications.

EP30D-7 Product Information

EP30D-7 Two Part Urethane Modified Epoxy System

Flexibilized, Two Component, Room Temperature Curing, Urethane-Modified Epoxy System Featuring Superior Toughness, and Abrasion Resistance for High Performance Bonding, Sealing, Coating and Encapsulation

EP30HT Product Information

EP30HT Two Part Epoxy

Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Potting Featuring Optical Clarity and High Temperature Resistance. Conforms to FDA Section 175.105 for Indirect Food Applications.

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