One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Sealing, Coating and Bonding Applications; Featuring Low Viscosity and Excellent Electrical Insulation Properties. Available in 30 Gram Cookies.
Low Viscosity, Optically Clear Two Component Room Temperature Curing Epoxy Resin System for High Performance Bonding, Casting and Coating Applications Featuring Exceptionally Long Working Life and Low Exotherm
High Performance Low Viscosity, Flexible Optically Clear Epoxy System for Large Castings, Sealing & Bonding Featuring Exceptionally Long Working Life and Low Exotherm During Cure.
Low Viscosity, Fast Curing, Two Component, High Performance Optical Epoxy for Bonding, Sealing, Coating and Casting Featuring Excellent Chemical Resistance.
Two Component, Low Viscosity, Room Temperature Curing Epoxy Resin System For High Performance Potting, Encapsulation, Sealing and Bonding Featuring Outstanding Resistance to Thermal Shock and Mechanical Vibration, Serviceable up to 450°F
One Component, Thermal Shock and Heat Resistant, Flexibilized Epoxy System for Bonding, as well as for Potting and Encapsulations up to ¼ Inch Thick; Features Good Toughness and Fast Cures.
One Component Thermal Shock and Heat Resistant Flexibilized Epoxy System For High Performance Electrical Potting, Encapsulation and Bonding Superior for underfill applications
