Chemically Resistant

EP112 Product Information

EP112 Two Part Epoxy

Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation

EP113 Product Information

EP113 Two Component Epoxy

Two Component Nanosilica Reinforced Epoxy Resin System Featuring Outstanding Mechanical Properties, Excellent Electrical Insulation, Superior Abrasion Resistance & Hardness as well as Optical Clarity for Coating, Casting, Potting, Encapsulation & Sealing for Services from -100°F to 500°F!

EP125 Product Information

EP125 Two Component Epoxy

Two Component Toughened Epoxy Resin System for Prolonged Service above 500°F with Outstanding Chemical Resistance.

EP126 Product Information

EP126 Two Component Epoxy Compound

Two Component Toughened Epoxy resin Based High Temperature Resistant Adhesive System For Prolonged 500°F Service With Outstanding Chemical Resistance

EP15 Product Information

One Part Epoxy EP15

Specialized, One Component, Heat Curing Epoxy Featuring High Tensile Strength for Testing Adhesion or Cohesive Strength of Flame-Sprayed Coatings as per ASTM Specification C633.

EP17HT Product Information

EP17HT One Part Epoxy

One Component, Epoxy System for Bonding, Sealing, Coating and Casting Heat Featuring Exemplary Temperature and Chemical Resistance. Notable Retention of Properties at High Temperatures, Serviceable Up to 600°F.

EP17HT-3 Product Information

EP17HT-3 One Part Snap Curing Epoxy

One Component, Heat Curing Epoxy Featuring "Snap Curing" Along with High Temperature Resistance up to 400°F; Can Cure in Sections up to ¼ Inch Thick.

EP19HT Product Information

EP19HT One Component Epoxy System

One Component, Storage Stable Epoxy Resin System for Durable High Performance Adhesive/Sealants, Impregnants and Liners

EP19HTFL Product Information

EP19HTFL One Part Epoxy

One Component, Flexibilized Epoxy Resin System For Durable High Performance Adhesive/Sealants, Impregnants and Liners, with Good Storage Stability

EP21 Product Information

EP21 Two Component Epoxy Compound

Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.

Pages