Two Part, Room Temperature Curing Epoxy System Offers Thermal Conductivity and Electrical Insulation for Potting & Encapsulation as well as Bonding, Sealing and Coating; Has a Forgiving One to One Mix Ratio.
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Acids Along with Higher Temperature Resistance.
Low Viscosity, Toughened, Two Component Epoxy System for High Performance Bonding, Sealing and Encapsulation, Capable of Withstanding Rigorous Thermal Cycling; Very Low Exotherm and Exceptionally Long Working Life.
Two Component, Room Temperature Curing Adhesive, Sealant & Coating Featuring Convenient 1:1 Mix Ratio and High Temperature Serviceability Up To 400°F Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating, and Heat Resistant Epoxy Compound for High Performance Bonding and Sealing. Serviceable from 4K to 400°F. Meets NASA Low Outgassing.
