One Component, Epoxy System for Bonding, Sealing and Coating Featuring Very Fast Cure along with High Shear Strength Properties. Meets USP Class VI Specifications.
One component, low viscosity, dual curing, cationic type system. Good flexibility. Serviceable from -80°F to 300°F.
One component, medical grade toughened epoxy system for bonding and sealing
Two part medical grade silicone for high performance bonding and sealing
One component, dual curing LED system with a specialty light penetration profile allowing for rapid fixturing and subsequent curing by heat
