Dimensionally Stable

Two Component, Thermally Conductive, Electrically Insulating, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing, Coating, Potting and Encapsulation. Cryogenically Serviceable and Capable of Withstanding Cryogenic Shock. Meets NASA Low Outgassing Specifications.

Highly Versatile, Low Viscosity, Two Component Epoxy System for High Performance Bonding, Coating, Sealing and Casting; Featuring Superb Optical Clarity.

Low Viscosity, Two Component Epoxy Resin System For High Performance Bonding, Laminating and Sealings

Two Component, Room Temperature Curing Epoxy for Potting, Bonding, Sealing and Coating with Unsurpassed Thermal Conductivity and Superb Electrical Insulation; Features Low Viscosity and Excellent Thermal Transfer Properties.