Dimensionally Stable

EP34 Product Information

EP34 Two Component Epoxy

Two Component, Room Temperature Curing Epoxy System For High Temperature Potting & Encapsulation Applications

EP34AN Product Description

EP34AN Two Part Epoxy System

Two Component, Room Temperature Curing Epoxy System Featuring High Temperature Resistance And Exceptionally High Thermal Conductivity.

EP34AO Product Description

EP34AO Two Part Epoxy System

Two Component, Room Temperature Curing Epoxy System Featuring High Temperature Resistance And Excellent Thermal Conductivity.

EP34CA Product Information

EP34CA Two Part Epoxy

Two Component Epoxy Resin System for High Pertormance Applications

EP36AN Product Information

EP36AN One Component, B-stage Epoxy

One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Encapsulation, Coating and Bonding Applications; Featuring Very High Thermal Conductivity and Electrical Isolation. Available in 30 Gram Cookies.

EP36CLV Product Information

EP36CLV One Part Epoxy Compound

One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Sealing, Coating and Bonding Applications; Featuring Low Viscosity and Excellent Electrical Insulation Properties. Available in 30 Gram Cookies.

EP3LV Product Description

EP3LV One Part Epoxy

One Component Heat Curing Epoxy Adhesive Featuring Both High Shear and High Cure Speed for Optimal Bonding Performance

EP3RR-1 Product Description

EP3RR-1 One Part Epoxy

One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.

EP3RRLV Product Information

EP3RRLV epoxy adhesive

One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.

EP42HT-2AO-1 Black Product Information

EP42HT-2AO-1 Black Two Part Epoxy

Two Component, Thermally Conductive, Room Temperature Curable, Heat Resistant Epoxy Adhesive, Sealant, Coating & Casting System with Excellent Chemical Resistance and Electrical Insulation Properties. Ideal for Potting & Encapsulation Applications. Passes NASA low outgassing. Cryogenically Serviceable.

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