Two Component, Low Viscosity Epoxy Adhesive/Sealant For High Performance Bonding Featuring Excellent Electrical Insulation Characteristics, High Thermal Stability and Superior Chemical Resistance.
Two Component, Low Viscosity, Room Temperature Curing Epoxy Resin System For High Performance Potting, Encapsulation, Sealing and Bonding Featuring Outstanding Resistance to Thermal Shock and Mechanical Vibration, Serviceable up to 450°F
One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.
One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.
Two Component, Flexible, Low Viscosity Epoxy Compound With Outstanding Shear and Peel Strength For Bonding, Potting, And Sealing. Featuring Excellent Adhesion To Engineering Plastics And Metals, Especially Polycarbonates And Acrylics
Two Component Epoxy Resin System for Durable, High Performance,
High Strength Coatings, Liners and Sealants Featuring Chemical Resistance and Fast Cure.
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Solvents, Alcohols and Fuels.
