Two Component Low Viscosity Epoxy System For High Performance Bonding, Sealing, Coating. Including Small Encapsulations, Pottings & Castings Featuring Fast Set-Up and Handling Time Meets USP Class VI and ISO 10993-5 Specifications for Medical Applications.
Two Component, Low Viscosity Room Temperature Curable, Epoxy Adhesive, Sealant, Coating & Casting System Featuring Both Outstanding Chemical and Heat Resistance.
Two Component, Room Temperature Setting, Heat Resistant Epoxy System for Bonding, Sealing, Coating & Casting Specially Formulated for Food Applications.
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive, Sealant and Coating Featuring a Convenient 1:1 Mix Ratio and Fast Cure
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive, Sealant and Coating Featuring a Convenient One To One Mix Ratio and Fast Cure.
Two Component, Low Viscosity, Addition Cured Silicone System for High Performance Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Optical Clarity.
