Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Solvents, Alcohols and Fuels, Along with High Temperature Resistance.
Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance.
One Component, Room Temperature Curing Silicone Elastomer Adhesive
for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.
Meets MIL-A-46146.
One Component, Room Temperature Curing Silicone Elastomer Adhesive
for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.
Meets MIL-A-46146.
Two Component, Heat Resistant, Epoxy System for High Performance Bonding, Sealing and Casting. Features a Glass Transition Temperature in Excess of 220°C; Requires Elevated Temperature Curing at 250°F or Above.
Two Component, Heat Resistant, Epoxy System for High Performance Bonding, Sealing and Casting. Features a Glass Transition Temperature in Excess of 220°C; Requires Elevated Temperature Curing at 250°F or Above.
