Non-Drip

Two Component, Paste Consistency Room Temperature Curing Epoxy Adhesive for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability and Machinability along with Superior Chemical Resistance.

Two Component, Room Temperature Curing Epoxy System Featuring High Temperature Resistance And Excellent Thermal Conductivity.

Two Component, Heat Curing Epoxy Adhesive For High Temperature Bonding Applications

Two Component, Flexible, Low Viscosity Epoxy Compound With Outstanding Shear and Peel Strength For Bonding, Potting, And Sealing. Featuring Excellent Adhesion To Engineering Plastics And Metals, Especially Polycarbonates And Acrylics