Two Component, Lower Viscosity Room Temperature Curing Epoxy Adhesive for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability and Machinability along with Superior Chemical Resistance.
Two Component, Paste Consistency Room Temperature Curing Epoxy Adhesive for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability and Machinability along with Superior Chemical Resistance.
One Component, High Temperature Resistant, Toughened Epoxy System for Potting, Encapsulation, Coating and Bonding Applications. B-Stage Epoxy Is Available in 30 Gram Cookies.
