Expanded Product List
Master Bond Product Search
435 products match
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EP21NDFG Non-drip epoxy paste. Meets FDA Section 107.105 for indirect food applications. Can be used for bonding, sealing, coating. Able to adjust hardness of the cured system by altering the mix ratio. Excellent electrical insulation properties. Serviceable from -60°F to 250°F. |
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EP21NS Moderate viscosity Nanosilica epoxy resin system. High strength rigid bonds. Lower linear shrinkage after cure. Serviceable from -80°F to +250°F. Cures readily at room temperature. |
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EP21Q Two component quartz filled epoxy compound. Protects against corrosion. Paste viscosity. Paste viscosity. Can be applied on vertical surfaces without dripping. High strength system. Excellent dimensional stability. Service temperature range from -60°F to 250°F. |
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EP21SC-1 High performance, abrasion resistant epoxy system. Silicon carbide filled compound. Convenient one to one mix ratio. Resists thermal cycling and many chemicals. Exceptional bond strength. Low coefficient of thermal expansion. Excellent electrical insulation properties. Paste consistency. Serviceable from -60°F to 250°F. |
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EP21SL5 Epoxy adhesive for bonding teak wood and other types of wood. Inique capability of adhering well to oily surfaces. Inert to water and many chemicals. Service temperature range -60°F to 275°F. 100% reactive. High strength. Long term durability. |
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EP21TDC Superior toughness. Ideal for bonding similar and dissimilar substrates. Withstands aggressive thermal cycling. Convenient one to one mix ratio. Good flow properties. User friendly. Versatile cure schedule. Serviceable from -60°F to +250°F. |
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EP21TDC-2 Highly flexibilized. Serviceable from 4K to +250°F. Excellent peel strength. Superb thermal and electrical insulator. Good flow. Easy to apply. Low exotherm. Cures at ambient temperature. Variable hardness depending on cure schedule. |
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EP21TDC-2ND Two part highly flexible epoxy resin system. Smooth paste viscosity. Fills gaps. Excellent peel strength. Dependable resistance to thermal cycling. |
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EP21TDC-4 Two part, room temperature curing epoxy with outstanding flexibility and superb adhesion to many rubbers and metals. Excellent thermal cycling properties. Ability to withstand mechanical shock and vibration. T-peel strength 25-35 pli. Elongatio >200%. Water and chemical resistant. Operating temperature range -100°F to +250°F. |
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EP21TDC-4HT Toughened epoxy compound for high performance bonding, sealing, casting. Serviceable from -65°F to +400°F. Cures at ambient temperatures. Excellent electrical insulative characteristics. Compound flows readily. Bonds well to untreated rubbers such as neoprene, nitrile SBR and EPDM. Superior shear and peel strength properties. |