Electrically Insulative

One Component, Nanosilica Filled UV Curable Epoxy System that cures in shadowed out areas for Bonding, Sealing, Coating and Encapsulation. Thixotropic, moderate viscositiy.

One Component, Higher Viscosity UV Curable System for High Performance Bonding, Sealing and Coating, Featuring Excellent Physical Properties, Dimensional Stability and Chemical Resistance with an Outstanding Tg

Two Component, Flexibilized Epoxy System for High Performance Bonding, Coating, Sealing and Encapsulation with Convenient One to One Mix Ratio, Features Superior Thermal Cycling Capabilities, Along with Resistance to Vibration, Impact and Thermal Shock.