Expanded Product List
Master Bond Product Search
623 products match
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EP3FL Flexibilized one part epoxy system. Withstands severe environmental conditions in service. 100% reactive. Brown/yellow color. Resists thermal and mechanical stresses. Low shrinkage. Serviceable from -100°F to +250°F. |
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EP3HT Fast, one component heat curable adhesive. Serviceable from -60°F to +400°F. High shear strength properties. Shore D hardnes >70. "Unlimited" working life at room temperature. Superb electrical insulator. Withstands 1,000 hours 85°C/85% RH. |
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EP3HT-LO Rapid curing, one part epoxy. Meets NASA low outgassing standards. Moderate viscosity. High shear strength. Serviceable from -60°F to +400°F. Withstands 1,000 hours 85°C/85% RH. |
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EP3HTFL Heat resistant, flexibilized one component epoxy resin system. Superior physical strength properties. Inert to water and chemicals. Provides protection against rigorous thermal cycling and mechanical stress. Serviceable from -60°C to +175°C. |
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EP3HTMed Rapid curing, one part epoxy. Meets USP Class VI biocompatibility standards. Thixotropic paste viscosity. High shear strength. Superb resistance to autoclaving, chemical sterilants, radition, EtO. Serviceable from -60°F to +400°F. |
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EP3HTN Nickel filled electrically conductive epoxy adhesive has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Smooth paste, consistency. Dispensible from syringe applicator. Serviceable from -60°F to +400°F. |
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EP3HTND-2 Black Rapid curing, one part epoxy. Meets USP Class VI biocompatibility standards. Non-drip, paste viscosity. High shear strength. Superb resistance to autoclaving, chemical sterilants, radition, EtO. Serviceable from -60°F to +400°F. |
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EP3HTND-2Med Black Rapid curing, one part epoxy. Meets USP Class VI biocompatibility standards. Non-drip, paste viscosity. High shear strength. Superb resistance to autoclaving, chemical sterilants, radition, EtO. Serviceable from -60°F to +400°F. |
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EP3HTS Silver filled electrically conductive epoxy adhesive has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Smooth paste, consistency. Dispensible from syringe applicator. Serviceable from -60°F to +400°F. |
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EP3HTS-LO High performance, one component silver filled electrically conductive adhesive. Low volume resistivity. Bonds wells to a wide range of substrates. Meets NASA low outgassing requirements. Thermally conductive. Rapid cures at moderate temperatures. Easy to dispense. Serviceable from -60°F to +400°F. |