One Component, Room Temperature Curing, Silicone Elastomer System for High Performance Bonding and Sealing Featuring Fast-Curing and Low Viscosity. Ideal for Smaller Encapsulations and Conformal Coatings.
One Component, Room Temperature Curing, Silicone Elastomer System for High Performance Bonding and Sealing; Featuring Flowable, Non-Corrosive Cure and Serviceability Up to 300°C; Unsurpassed Stability at Elevated Temperatures.
One component Room Temperature Curing Non Corrosive Silicon Elastomer Compound For High Performance Bonding and Sealing With A Service Temperature Range Up To 500°F(260°C)
One Component, Heat Curing Epoxy Adhesive Featuring both High Shear and High Peel Strength for Optimal Bonding Performance & Exceptionally High Thermal Conductivity
One Component, Thermally Conductive, Electrically Insulating Epoxy Featuring Excellent Bonding and Physical Strength Properties, Along with a Superior Ability to Withstand Thermal Cycling. Cryogenically Serviceable. Requires Oven Curing.
