Two Component, Room Temperature Curing, High Temperature Resistant Epoxy Adhesive/Sealant for Service from -112°F to +400°F Featuring High Peel and High Shear Strength. Meets NASA Low Outgassing Specifications.
Toughened Thermally Conductive Electrically Insulating Two Component Epoxy System For High Performance General Purpose Bonding, Sealing and Casting Featuring Superior Flowability and High Temperature Resistance
Two Component, Room Temperature Curing, Toughened Epoxy Adhesive/Sealant for High Temperature Bonding Applications Up To 425°F. Features Convenient Handling
Two Component, Room Temperature Curing, Toughened Epoxy Adhesive/Sealant for High Temperature Bonding and Sealing. Offers High Shear and Peel Strength, Along With Convenient Handling.
One Component, Heat Curing Epoxy Adhesive, Sealant Featuring Both High Shear and High Peel Strength for Optimal Bonding Performance and Exceptionally High Thermal Conductivity
One Component, Heat Curing Epoxy Adhesive, Sealant Featuring Both High Shear and High Peel Strength for Optimal Bonding Performance and Exceptionally High Thermal Conductivity
One Component, Thermally Conductive, Low Temperature Heat Curing Epoxy Adhesive Featuring Both High Shear and High Peel Strength for Optimal Bonding Performance.
